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CPU Supports Intel® Socket P, Core™ 2 Duo Family Processors Supports 800 FSB CPU
内存 2 x DIMM, Dual channel DDR2 533/667 MHz up to 4 GB
芯片组 Chipset Intel® GME965 ICH8M I/O Controller Hub
BIOS Award System BIOS Plug & Play support 4M bits flash ROM
网络 Intel 82573L LAN Chip 5 x PCI Express x 1 Lanes down to the carried board Supports PXE LAN boot ROM for Ethernet Boot up Supports Wake on LAN
显示 Intel® GME965 integrated graphics solution w/ Intel® Extreme Graphics 2 technology Up to 64 MB of dynamic video memory allocation One PCI Express x 16 Lane down to the carried board Drive a standard progressive scan analog monitor with resolution up to 2048 x 1536 @ 60Hz Supports LFP (local flat panel) LVDS interface resolution up to 1366 x 768 Single- or dual-pixel LVDS panel support up to UXGA panel resolution (1600 x 1200) Supports Single channel for 24 bit/Dual channel for 24 bit Supports UXDA 1600 x 1200 @ 75HZ (4:3) Supports WUXDA 1920 x 1200 (Wide Screen) Supports S-Video up to 1024 x 768 NTSC/PAL and 1080p HDTV
Audio HD Audio Interface
COM Express Connectors AB 3 x SATA / LVDS / 8 x USB 2.0 / 5 x PCIe x1 / GPIO / VGA / HDTV / HD Audio / RTC / BIOS Disable CD IDE / PCI / SDVO / PCIex16
板载RTC On chip RTC with battery back up 1 x external Li-ion Battery RTC Torrance less than 2sec (24 hours) under 25˚C environment
系统监控 Derived from Super IO to support system monitor Monitoring of 4 voltages, 2 temperatures and 1 fan Speed 4 voltage (For +3.3 V, +5 V, +12 V, Vcore) 2 Temperatures (CPU and one external Temperature Sensor)
电源需求 Follow the COM Express Specification
尺寸 COM Express Extended Module Type 2,155 mm (L) x 110 mm (W) (6.1 x 4.3)
环境 操作温度: 0°C to 60°C 存储温度: -20°C to 85°C 相对湿度: 5%~95%( 无凝露)
认证 CE approval FCC Class A |